Research On The Key Technology Of High-power Electronic Components Array Cooling

As the fast development of electronic technology and the integration level of chips, the chips'power is increasing greatly while the chips'scale shrunk quickly. It's hard to make them keep cooling by traditional methods. The original main methods include increasing the velocity of the cooling medium or optimizing the structure of heat transfer surface etc. However, the flow resistance increased and the stability and energy efficiency reduced markedly because of the velocity increasing. To optimize the structure of heat transfer surface is also limited by the flow resistance as well. The medium temperature could be dropped below the ambient temperature by miniature vapor-compression refrigeration system(VCR), so more heat could be carried off under the same heat transfer coefficient; On the other hand, the jet impingement has the highest heat transfer coefficient in convection heat transfer, it could get the bigger heat flux with lower flow velocity than parallel flow, it's very suitable to cool the high flux electronic components arrays. So an integrated solution including VCR cooling source and jet impingement cold plate had been proposed to cool the high-power electronic array.The smallest single screw refrigeration compressor around the world was developed as the core component of VCR cooling source by our laboratory. An experimental system was built to test the performances of the single screw compressor. On the initial stage, the discharge gas temperature of compressor was so high that the compressor can not stably operate. The problem was later solved by injecting the refrigerant liquid to the inlet of compressor. The performance and characteristics were obtained by experiments. The influence of condensing temperature, the frequency of the electric motor and the amount of refrigerant charge on the performance of compressor were tested and analyzed. The experimental results provide some valuable data for the improvements of the stability and COP of compressor.A submerged impingement cold plate was designed for cooling an electronic system and there are 80 chips symmetrically distributed on both side of the cold plate. Each 3×3㎜ chip's heat flux reaches up to 3×106W/㎡. The calculation and analysis of temperature distribution, flow resistant, fluid distribution and structure strength of the cold plates with different parameters and configuration were performed, The optimum design of cold plate were proposed.