A Design Of High-power Chip Heat Sink

IC chips are moving toward high integration,high speed,and small size,As the density of transistors on the chip increases,the chip generates more and more heat,If the excess heat is not released immediately,the temperature of the chip will rise.The temperature will seriously affect the performance and reliability of the chip,To make the chip work stably,the design of the chip’s heat sink is particularly important.The paper proposes three different heat dissipation schemes for three different package structures and different power chips,and uses FLOTHERM software to establish a model for simulation and analysis.For QFN-type packaged chips,We consider using a combination of TEC modules and forced convection heat dissipation,Using simulation optimization,the chip with a power of 300 W can be cooled to 76°C by encapsulating the TEC inside the chip.For MCM packaged chips,For MCM-type packaged chips,using a combination of semiconductor cooling and air-cooling to dissipate heat in the upper part of the chip,the chip with a power of800 W can be cooled to 57.3°C.Finally,for IGBT chips,change the package structure and use double-sided heat dissipation.The water cooled plate is used below,and the upper part is cooled by air cooling.The temperature of the IGBT chip with 40 kW power can be reduced to 60.3°C.Through the research of this paper,the three schemes proposed can successfully improve the heat dissipation capacity of the chip and ensure the reliability of the chip during operation.