Research Of The Techniques Of Sensor's TEC Cooling Package

To some sensors,such as image sensors and pressure sensors,their key performance will affected by the temperature when their temperature is above absolute zero.The higher the temperature is,the higher their thermal noise is and the lower their sensitivity is while they are working.To solve this engineering problem,we have studied a kind of thermoelectric cooling package for some sensors.We can use thermoelectric coolers to cool their temperature down to suppress the thermal noise because of working or the declining of sensitivity result from the high temperature.Some research have showed high temperature accelerate the sensor chip's burn-in.So integrating the sensor's chip with TEC cooling package is necessary.This paper includes contents as following:The first part we introduce the structure and functions and the significance of sensor's TEC cooling package.We conclude and contrast sensor's cooling methods and state the advantages and characteristics of TEC cooling package.We also introduce TEC cooling package's research trends and development situation at home and abroad and point out the unbalance in this techniques.The second part we introduce the effect and fundamental of TEC and list some formulas about the TEC which can help us estimate the cooling power of the TEC.We summary a method to select TEC and tell the detailed selecting process of our TECs.The third part we present the process of designing of the TEC cooling package.Firstly,we use ANSYS Icepak to simulate the TEC cooling package.We write down detailed simulation's process and analyze the simulation result.Then we research the structure of the package and summary the material of each part and techniques of the lead and methods of selecting heatsink.At last,we introduce the controlling system.We use an FPGA as the MCU.Controlling the TECs by an H-Bridge with PWM computed from digit PID algorithm.We use PT1000 and the A/D convertor is MAX31865.The upper computer communicates with the controller and set up the target temperature by UART.The last part we set up the experimental platform of sensor's TEC cooling package.Then we design some experiment and analyze the experimental results.