Vibration Analysis And Reliability Research Of Packaging On LTCC Substrate

This paper is subject to the electrical inter-connect structure as the research object. according to the background of the project, established the structure of solid model, meshed the model with the application of ANSYS finite element software and realized the dynamic simulation and reliability analysis. The specific content that contains the following, a statement of the current situation of electronic package, discussed the reliability of electronic packaging in the direction of the main research content and method; then as the necessary theory in this paper, introduced the main methods of the analysis of the structural dynamics, including modal analysis and dynamic response analysis; the FEM software ANSYS has been used in the overall dynamics of the model simulation analysis, including a half sine shock, modal analysis and random vibration analysis, simulation analysis has been calculation, and works with the actual situation in contrast, discuss the difference between the both; At last based on the reliability of the sensitivity analysis through ANSYS finite element software on the inter-connect structure. To determine the output of the failure probability and the most variable parameters, put forward a theoretical basis for the actual work.