| SiP is one important development direction of electronic packaging, its vibration analysis and reliability working in the bad vibration environment are important guarantee the reliable work. In this paper, based on the structural characteristics of SiP, model of LTCC and the chip has been establish in PRO-E,analysis simulation of the vibration spectrum and calculation of sensitivity has done for SiP. The major work is, introduced the principle of finite element software calculation, the steps of simulation, the skills of mesh and the results of the observation., writing the program by APDL. Fnally useing the stress - interference theory in mechanical reliability to calculate the sensitivity of the chip FLASH in SiP system .According to the analysis results of the reliability sensitivity, position of SiP chips was optimized by ANSYS software. Solved the problem which chips on SiP has too much stress response, the chips on SiP strength, reliability and performance have been enhanced. |
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