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Keyword [temperature cycling]
Result: 1 - 17 | Page: 1 of 1
1.
Analysis On Thermal Stress And Thermal Reliability Of BGA Packaging
2.
Highly Accelerated Stress Test Technique On High-density Packaging Integrated Circuits
3.
Temperature Cycling Reliability Of Plastic Packages Ball Grid Array Study
4.
Shear Resistance Strain Of The Solder Joints Under Tensile And Temperature Cycling Conditions
5.
Research On Reliability Of Silicon Via Interconnect Technology
6.
Study On Reliability Of Re - Wiring Wafer - Level Package
7.
The Reliability Effect Of Interface Reaction With Finishes And SnAgCu On The Solder Joint
8.
Simulation And Experimental Verification On The Reliability Of BGA Packaging
9.
Chip Bonding Process And Reliability Study Of System In Package
10.
Numerical Research Of Thermal Resistance And Thermal Reliability Tests Of Diecrete Power Device Packages
11.
Fatigue Properties Of COG Assembly Under Thermal-electric-mechanical Loading
12.
Thermal Fatigue Life Prediction Of IGBT Based On Structure Function
13.
Research On Solderability And Temperature Cycling Reliability Of SAC305 Lead-free Solder Joints Fabricated In Protective Reflow Atmospheres
14.
Research On Environmental Stress Screening Technology Of Circuit Board Assembly
15.
Reliability Research On Technology-Service Process Of Flip Chip Package Components
16.
Research On High Reliability Packaging Technology Of IGBT High Power Module
17.
Reliability Simulation And Life Prediction Of TSV Structures Under Multi-stress Coupling
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