Reliability Simulation And Life Prediction Of TSV Structures Under Multi-stress Coupling

As the latest generation of packaging technology,3D electronic packaging has promoted the development of the whole packaging industry.As the key technology of 3D electronic packaging,the reliability and service life of TSV directly affect the reliability and service life of the whole 3D packaging electronic products.Therefore,it is very important to study the reliability and life of TSV structure.In the actual working environment,temperature,current and random vibration are the main factors that affect the reliability and life of TSV structure.Electric stress effect on the reliability of the TSV is mainly in micro convex point,the electromigration when large current density through the TSV structure,will trigger a significant electric migration phenomenon,when the current density in Al interconnect 106 A/cm2,Al interconnection of cathode and anode are damage happens,found caused by atomic hole hollow cathode,and the anode is the accumulation of atoms.Lead to TSV structure failure;When TSV structure in alternating temperature cycling conditions,due to the differences in thermal expansion coefficient of each composition,the thermal stress and deformation in TSV structure deformation,such as heating TSV structure within the Cu in the process of the axial expansion of the dielectric layer in axial tensile strain,and Cu radial expansion makes the dielectric layer in the radial compressive strain,all of this will accelerate the failure caused by sliding friction slip or diffusion mechanism,the influence on the reliability of the TSV structure.In addition,the TSV of metal matrix composites filled more and more attention,because of the filling of non-metallic materials of thermal expansion coefficient is very low,after joining can decrease thermal expansion coefficient of the composite material,at the same time,filling material under the condition of ensuring connectedness,its good elastic performance can effectively absorb the thermal stress in TSV;Under the loading condition of random vibration,the TSV structure will have dynamic displacement or collision due to the difference of each component,which will cause or aggravate the fatigue and damage of the structure,and finally lead to the failure of the device.In addition,under the simultaneous action of multiple loads,the failure mechanism of TSV structure is more complex.On this basis,the main research contents of this paper are as follows:Conduct electromigration,finite element simulation analysis of TSV structure under high and low temperature cycles and random vibration loads respectively,clarify the theoretical model and life prediction model,and conduct corresponding induction and summary;The research objective is the TSV life prediction under the combined effect of heatelectricity-vibration,involving three load conditions;A new type of TSV structure filled with polymer is proposed.Compared with the traditional TSV structure and the new TSV structure,due to the presence of the filled polymer,the TSV structure has a stress-relieving effect,and different parameters are orthogonalized.Test design,and get the law of influence of main structural parameters on it.