Thermal Design And Structure Improyement Of Special Electronic Shelter

With the development of electronics system, larger scale of system integration,higher density of powers, which causes that the heat elimination is reflected moreprominently. Now, technique of thermal analysis and design are widely used in thermalcontrol of different levels,such as component level, circuit level, equipment level andsystem level. It plays a more important role especially in the designing stage of (a)complicated electronic equipments(system), which is used to improve the reliability ofthe product, to cut the cost and to increase its efficiency.The electronic equipment shelter is a typical carrier of system-level electronicequipments. The further study in the thermal problem of electronic equipments, to findthe key point and the technique method of thermal designing problem in system-levelequipments, will be of great significance to the total design.Firstly, the development and application of the technique about thermal analysisand design at home and abroad is introduced. Secondly, the related and basic theoriesabout thermal analysis is discussed in detail, and the important steps and the key pointof applying the ICEPAK software are explained. Then the structure characteristics anduse conditions of the shelter to be designed is presented.A system initialization modelis made and simplified using the thermal analysis software. Based on the givenboundary condition,a thermal simulation was carried out. Through the further researchon the simulation results, the improvement of the heat elimination thoroughfarestructure of the shelter is proposed, and the related elimination equipments in it wereadjusted.The comparative analysis of improved simulation results and the practicalapplication proves the validity of the pre-analysis in design phase.Based on the simulation by ICEPAK to the appropriative electronics shelter andanalysis，as to the shelters of typical feature structure, the aspects to be noticed indesign and application and the many questions in structure layout to be considered aresummarized. The quantitative problem of thermal design of system level is solvedwhile making a scheme. All of this will bring great help to the demonstrability of theproject.