Preparation And Performance Of Encapsulation Material For Organic Light-emitting Device

Organic light emitting displays (OLEDS) are considered as one of the most potential in the next generation display technology. Nowadays, display technology already entered industrialization moment. However the short operation lifetime hinders the process of OLED technology to industrialization.In this paper, plasma- enhanced chemical vapor deposition (PECVD) technique was used to deposit polymethyl methacrylate films, fluorinated polyacrylate and SiO2-like films on the ITO glass under the conditions of low temperature and low pressure with methyl methacrylate, fluorinated polyacrylate and TEOS organic source. This research was focused on the evaluation of film morphology, film thickness, film optics transparent ratio and hydrophobic performance, by changing the experimental parameters including RF power, discharge time, chamber pressure, and the flow rates of monomer.The results showed that PECVD technique was used to deposit polymethyl methacrylate film that was smooth, dense, and structurally amorphous, the prime chamber pressure of film preparation is 100Pa around. Film optics transparent ratio amount to 80% above, at wavelength 550 nm film optics transparent ratio amount to 99%.Surface roughness gradually decrease with increasing RF power, which from 21.81 decrease to 5.69; film thickness gradually increase with increasing RF power, at RF power 12W film thickness can reach to 20μm; contact angle increase from 12.55 to 85.11 with increasing RF power, which indicate film hydrophobic performance increase with increasing RF power.Fluorinated polyacrylate film was smooth, dense, and structurally amorphous, at wavelength 550 nm, film optics transparent ratio amount to 89%; Surface roughness decrease from 31.45 to 17.25, film thickness gradually increase from 10μm to 20μm and contact angle decrease from 86.86 to 79.69, which nearly not change with increasing RF power. Organic silicon polymer film was smooth, dense, and structurally amorphous, at wavelength 550 nm, film optics transparent ratio amount to 92.5%; Surface roughness decrease from 47.27 to20.88, film thickness gradually increase and contact angle increase sharply from 59.47 to 83.51, which nearly not change with increasing RF power. Multilayer film optics transparent ratio amount to 82%, surface roughness was more than monolayer film, film thickness gradually increase with increasing RF power.From the study, it is apparent that polymethyl methacrylate, fluorinated polyacrylate and SiO2-like films possess high quality, good controllability and low reaction temperature compared with traditional CVD method. Then it has higher safety and lower cost for mass production. Can be widely applied to IC manufacture field more and more.