Design And Numerical Investigations Of Novel Micro-Channel Heat Sinks

Owing to the advances of electronic technology, the power and circuit density of electronic devices have increased dramatically. As a result, more heat is generated and has to be dissipated using thermal management methods. Because of the thermo-physical limitation of air, traditional air cooling is insufficient to dissipate such a high heat flux. Liquid cooling is expected to be the main candidate in the next generation of cooling technologies. Among all liquid cooling techniques, micro-channel cooling has received a great deal of attention, because of its simple structure and good cooling capacity. In particular, integrated micro-channel heat sinks which are fabricated together with electronic chips are considered to be the most promising solution because of its low thermal resistance.Traditional parallel micro-channels heat sinks have two critical shortcomings. One is the large pressure drop, which causes the problems of noise and requires bulkier packaging and higher driving force; the other is the...