Study On The Optimization Design Of Composite Micro-channel Heat Sink

In recent years, semiconductor laser technology is developing rapidly.With the increasing power,and improving high-power semiconductor lasers integration,the heat flux is also growing.Conventional cooling devices have been unable to meet the cooling requirements,then the micro-channel heat sink emerged as a new radiator parts.Subsequently,the integrated micro-channel heat sink has received much concern due to the advantage of more prominent cooling capacity,the smaller thermal resistance and good compatibility.But the uneven temperature distribution and the large thermal strain have become the important issue restricting large high power semiconductor laser array development.In this paper, by using Aotodesk Inventor, computational fluid dynamics(CFDesign), Ansys Workbench, Matlab and other softwares, the traditional OFC micro-channel heat sink was carried out on the two-phase micro-channel and the parameters which influenced the heat disspation of the micro-channel heat sink and the package thermal strain were disc ussed in order to study the application of micro-channel heat sink in high-power semicondu ctor lasers.According to the theoretical analysis of the overall thermal resistance and the study of transfer characteristics,the feature sizes of the conventional five OFC micro-channel heat sinks has been optimized. Then compared the performance of imporved thermal and traditional micro-channel heat sink.At the same time,proposed a new method to improve the package effects between the micro-channel heat sink and GaAs laser chip.Tungsten copper material as the heat sink material,using the finite element analysis to calculate and analyze the thermal strain of the compound micro-channel heat sink. Finally,create a compound micro-channel heat sink,in line with high power semiconductor laser cooling and packaging requirements.The study showed that:⑴compared with traditional micro-channel heat sink,the improved compound micro-channel heat sink has a smaller hydraulic diameter, smaller thermal resistance and better temperature uniformity, Thermal resistance of about 0.25 / ℃W, compared to traditional micro-channel heat sink reduced by 30% to 50%;⑵The compound has a smaller thermal strain,smile can be controlled at less than 1μm;⑶The compound micro-channel heat sink has an optimal ratio of the thickness of the layers, it’s effect the overall thermal expansion coefficient of micro-channel heat sink,and was effected of the maximum temperature of the wall;⑷Compound micro-channel heat sink is far better than traditional micro-channel heat sink in two aspects:thermal resistance and thermal strain.Findings and conclusions have important guiding significance for micro-channel heat sink design.