Research On Fluid Flow And Heat Transfer Of The V-shaped Microchannel Heat Sink

Diode pumped solid state laser (DPSSL) developed in the 1990s is a new type of laser. DPL has the advantages of high efficiency, high light beam quality, tight structure and long life. With the improvement of the output power of the diode laser arrays, heat effect has become one of the key technologies which have restricted the development of high power density DL. Heat effect in solid lasers will cause two consequences: one is that thermal stress causes the actuating medium to destroy and limits the laser output average power; the other is that distortion causes the laser light beam drop in quality and the output laser brightness to reduce. So heat management is presented in diode laser array and other high power density devices such as microwave power amplifier and high performance CPU. Heat management becomes one of hot spots in present research. The V-shaped microchannel based on MEMS technology has the advantages of low thermal resistance, low flow quantity, high efficiency and small volume. This cooling scheme can dissipate heat from diode laser array and other high power density devices quickly and effectively. V-shaped microchannel has become a new type cooling scheme.The structure of V-shaped microchannel heat sink is extremely complex and irregular. Many difficulties were encountered during the process of theoretical analysis. By reason of the fact that theoretical analysis of rectangle is quite mature, the method of divided V-shaped microchannel into many rectangle microchannel is adopted at last. Although this method has introduced a large amount of assumed conditions, it is still one kind of research methods which makes the complex question become simple.Numerical simulation is adopted to investigate the influence of geometry parameter and boundary condition on cooling performance. The simulation results show that the influence of fluid velocity, inlet size and microchannel width is...