Electromagnetic Modeling And Analysis Of Vias In High-speed Circuit

It will be development trend that electronic products are becoming miniaturization and high performance, which decides that the clock frequency will becoming more and more higher and the rise time will becoming more and more shorter. At low frequency, the parasitical effects induced by interconnection lines have little influence on circuit performance. But in high-speed circuit the signal has wider effective bandwidth, so that the connection lines will induce reflection and ringing when transmitting the high-speed signal, and at the same time there are some crosstalk and coupling among connection lines and signal traces, which will induce a series of signal integrity (SI) problems and affect the whole system performance. The vias are discontinuous connections, which will induce more serious signal integrity problems and electromagnetic interference (EMI). So it is very important that vias are modeled and simulated accurately, speedily, efficiently.Electromagnetic modeling and characteristic of vias are investigated in high-speed circuit. The main research works are outlined as follows:1. The single-layer vertical vias are modeled based on Foldy-Lax equation. The each single-layer vertical vias are looked as multi-port network and the multi-layer vertical vias are modeled by multi-port network cascade theory. Scattering characteristic analysis was given at different geometry structure by numerical simulation results.2. The whole vias are modeled based on the modeling of through hole via and vertical vias. First, the whole vias are decomposed into exterior structure and interior structure. Then the exterior structure is decomposed into short circuit problem and wire antenna problem, and the interior structure is decomposed into some single-layer vertical vias. At last, all decomposed parts are connected by the continuity of currents at ports of every...