Development Of VLSI High Temperature Dynamic Burn-in And Detecting System Based On Embedded System And Programmable ASICs

With the fast development of information technology, integrated circuits are now widely used in various areas, meanwhile the density and the run-frequency of the IC are becoming much higher, the functionality are becoming more and more complex. As a result, the stability of the IC is more and more concerned. In the application of strategic weapon systems, aviation electronic devices and industry control, the stability of IC is vital to those systems, which is even more important than the IC's electrical requirements.The Burn-in Screening is still the efficient way to improve the stability of ICs. Up to now ,the third generation of VLSI high temperature dynamic burn-in and test systems have been already developed, such as BTI3000 system. Those kinds of systems are used to detect early failure component.This article is introducing some detailed technologies applied in developing BTI32000N, which is a kind of VLSI high temperature dynamic burn-in and test system, including the following contents:1. Introduce the concept and the significance of high temperature dynamic burn-in;2. Introduce the architecture of BTI3200N system and some the design methods;3. Introduce a specific embedded system used in BTI3200N system;4. How to design the Schematic and PCB of Graphic Generation and Detection System using Cadence EDA software tools;5. Implement of Graphic Generation and Detection System using Programmable ASIC;6. Debugging of the hardware and software of BTI3200N system.