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Test And Analysis Of CMOS Image Sensor

Posted on:2006-09-29Degree:MasterType:Thesis
Country:ChinaCandidate:B Y DongFull Text:PDF
GTID:2178360182976540Subject:Microelectronics and Solid State Electronics
Abstract/Summary:PDF Full Text Request
This paper is mainly about a part of research work on a paramount project totackle in Tianjin Science & Technology Committee "High Performance HighDynamic CMOS Image Sensor Design",it contains theory, process and result of test.Develop and breakthrough of science depend on the level of test technology, at thesame time the development and breakthrough of science also promote thedevelopment of test technology. Test technology has penetrated into science research,engineering practice and every aspect of daily life. CMOS image sensor integratesimage acquisition devices and processing circuits on a chip with CMOS plane process,which has advantage of high integration, random access, low voltage and low powerdissipation. This project includes design of pixel, digital programmer gain amplifier,analog-to-digital converter and timing control circuits, which is a VLSI mixed signalcircuit design. So it makes the test to image sensor become the test to SOC from thetest to SOB and the difficulty become bigger.There are five chapters in this paper, mainly record and narrate the developmentof COMS image sensor;analyze the construction and the function principles;selectseveral important parameters and some test targets to study in detail;list the testscheme and the last data result;analyze the difficulty we meet in the test process andbring out the way to solve them. The tasks of this thesis are shown as follows.1. Explain the operation principle of typical image sensor. Based on this indicatethe construction and operation principle of the image sensor we designed.2. Make the test plan, set down the specification and select felicitous equipment.3. Make sure the package;plan the wire bond diagram;compile the testspecification;design and manufacture the PCB for test;test the chip.4. Record the data and analyze them, find out what should to be improved indesign course.Till now the test has been finished mostly. We have finished the test forcomparator, secondary amplifier and clock modules. The data we derivedis seemed well and with these data we validate the correctness of thecircuit design. In the course of test we also sovled some difficulties,piled up experience for the next test operation.
Keywords/Search Tags:CMOS image sensor, test, mixed signal circuit, package, wire bond
PDF Full Text Request
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