Modeling And Analysis Of Signal Integrity In System-in-package

In the field of microelectronics,the integration of miniaturized systems is getting higher and higher,and the requirement for signal integrity of packaging is also getting higher and higher.In order to meet the above requirements,System-In-Package(SIP)technology is widely used in this field.With the increase of system frequency and the acceleration of signal rate,the signal integrity problem of SIP becomes more and more challenging.Aiming at the signal integrity problem of SIP,the main research contents of this paper are as follows: 1.Based on the basic theory of power distribution network,this paper establishes a simple SIP power distribution network model.Principle analysis and simulation modeling of each component module of power distribution network are carried out.Using cavity model analysis and calculation of power/ground plane impedance,two solutions to reduce the impedance of power distribution network are proposed according to the formula.The first method is to reduce the resonance point of the plane in the application frequency domain by changing the size of the power/ground plane;the second method is to reduce the impedance of the plane resonance by reducing the thickness of the medium and increasing the dielectric constant of the plane material.2.This paper uses HFSS software and ADS software to simulate and analyze the modules in the power distribution network connection line.The simulation results show that the parasitic inductance of the bonding line module has the greatest impact on the impedance in the power distribution network.3.A new method to improve the transmission characteristics of fixed structure bond-wire is presented in this paper.Based on the theory of low-pass filter,two innovative design methods of bond-wire interconnection circuits in microwave multi-chip modules are proposed: the first one is based on the compensation structure of bond-wire interconnection circuits based on third-order Butterworth low-pass filter;the second one is based on the compensation structure of bond-wire interconnection circuits based on fifth-order Chebyshev low-pass filter.When the bond-wire structure is fixed,these two methods can significantly improve the transmission characteristics of the bond-wire interconnection circuit.Compared with the uncompensated structure,the proposed compensation structure based on third-order Butterworth low-pass filter increases the bandwidth of the bonded interconnection circuit by 25.1 GHz.Compared with the uncompensated structure,the bandwidth of the bonded interconnection circuit based on the fifth-order Chebyshev low-pass filter increases by 56.8 GHz.Compared with the two compensation structures,the first one requires smaller circuit area and lower cost;the second one can achieve a larger bandwidth,but requires a larger circuit area,and because the Chebyshev low-pass filter itself has 0.5dB ripple in the passband,the compensation structure has 0.28 dB ripple in the passband.4.In this paper,the length of 50 ohm matched microstrip line in compensation structure circuit is simulated and analyzed.The simulation results obtained by changing the length parameters show that the length of 50 ohm matched microstrip line should be less than 1 mm.In this paper,the optimal design of bond-wire interconnection circuit is realized.The simulation results show that the compensation circuit designed in this paper can significantly improve the transmission characteristics of fixed structure bond-wire,and has guiding significance for practical engineering applications.