Electronic Equipment Environment Of High Temperature Hot Control Technology Research - Materials And Structure Simulation

With the development of micro-electrical mechanical (MEMS) technology, electronicproducts are developed to the miniaturization the high density, the direction of integration,and leaded to the heat-flow density becomes more and more high around the integrateddevices: For example, to the computer's CPU, the heat-flow density has reached60-100W/cm~2 when it was operation; the heat-flow density of the semiconductor lasers ishigher and even reached 103W/cm~2. However, the reliability of electronic equipment is verysensitive to temperature. When the temperature is increased by 1 in the 70-80 level, thereliability will be decreased by 5%. Therefore, how effectively solve the problem of coolingthe electronic components has become a key issue for electronic equipment manufacturing,and efficient thermal control technology also will become a hot research.This paper is mainly to heat insulation structural design of the electronic equipmentthermal control which are working under the hermetic environment of high temperature,then simulate and optimization design. Finally, it is concluded that the heat insulation effect ismuch best when the thickness of insulation is 10mm. Microporous calcium silicate flexibleinsulation material fiber reinforced aerogel insulation composite materials flexible substratewith vermiculite for the high temperature heat insulation materials compound aerogelinsulation materials are choiced and their performance are compared before extensive readingof materials. In comparison with the variety of thermal simulation software based on the hightemperatures in 300 , the adiabatic effect of airtight equipment is simulated with differentinsulation materials and heat insulation framework by ANSYS. Finally, the optimal structuredesign scheme and the composite aerogel which is a new electronic components surface heatinsulation materials are obtained.