Experimental Study And Numerical Simulation On Heat Pipe Radiator For CPU

With the continued increase in power dissipation and power-density of high performance microprocessors,as well as requirements for high-dissipation packaging and lower junction temperature,improvements of electronic cooling technologies have been becoming strategically important,in challenging of advanced thermal solutions achieving higher cooling efficiencies while meeting reliability,packaging,cost and environment requirements appropriate to various electronic equipments.Furthermore,as a topic of common concern,it is a key problem in thermal science.Use of heat pipe(or vapor chambers) is considered as one of the promising technology to extend the capability of air cooling.This paper reports a series of experimental research and numerical simulation of heat sink(heat pipe,vapor chamber),and uses the infrared (IR) thermal imaging camera comparing the experimental results with the numerical results to verify the validity of the numerical simulation.Optimization analysis is also carried out on improving the thermal diffusion capacity of heat sink base.According to the practical application of thermal chip,this paper designs an experimental table to measure the thermal performance and pressure drop in a fully ducted flow channel for three heat sinks.In the present study,a numerical analysis is carried out to investigate variation in CPU temperature,heat spreading thermal resistance,heat sink resistance,thermal conductivity of the heat sink base and the pressure drop with varied heat flux inputs and air speed. Furthermore,the thermal conductivity fitting formula and pressure drop fitting formula are obtained,which are in good with experimental results.Base on the operating conditions of heat sinks,simulation models are set up by using CFD software FLUNENT,ICEPAK,and their thermal performances are simulated and analyzed numerically.The rules of how elements influence on the thermal performance of heat sinks and the choice method in different heating power,different environmental conditions is worked out. For performance comparison,the experimental measurements are carried out by using infrared(IR) thermal imaging camera for access to heat sink temperature distribution.The experimental test proved the reliability of numerical simulation.Finally,the thermal analysis of heat pipe base has been optimized.By changing the conductivity and to expand the size of analog chips,it can further improve the cooling effect of heat sink,receive some valuable conclusions.All the above achievements help to promote the study of heat sinks,as well as it can be used to design and optimizing of heat sinks.