Electrical,Thermal Characterization And Optimization Of Three-Dimensional Integrated Packaging

Driven by the technology development,social needs and economic growth,IC industry is now faced with the increasing importance of two trends,"More Moore" and"More than Moore",where the emerging 3-D integrated packaging technology offers a promising approach for further development.Up to now,significant progress has been made in 3-D integration.However,there still exist severe electrical integrity problems,which is caused by the complex electromagnetic interference,as well as thermal integrity problems,which is caused by the increased power density due to stacking of dies.Therefore,this research will focus on the electrical,thermal characterization and optimization of 3-D integrated packaging.The main contributions of this research are summarized as follows:1)Theoretical analysis on the electrical characteristics and optimizations of multiport interconnects in 3-D integration are performed.A new CPW structure for the suppression of crosstalk is developed.Its electrical characteristics are analyzed and the structure is further optimized.The analysis is experimentally validated.Moreover,a common-mode filter based on the defected ground structure is presented.Its geometrical parameters' impact on the electrical characteristics is analyzed and these parameters are optimized by the machine learning(ML)method.2)Significantly improve the de-embedding accuracy of high-frequency electrical characteristics of multi-port TSVs in 3-D integration.The de-embedding structure and algorithm are firstly introduced and two critical requirements for applying the algorithm on multiport TSVs for high-frequency electrical characteristics are discussed.Then the techniques to meet the two requirements are developed by revising the structure and inserting shielding TSVs.The maximum relative error of the insertion loss is reduced from 33.52%to 4.67%.The de-embedding accuracy is significantly improved by them.Finally,the method is experimentally validated.3)The horizontal thermal characteristics of TSVs in 3-D integration are investigated using analytical methods,including their steady thermal characteristics for being heat sources and the transient ones for being thermal conductors.All the analytical derivations are validated by numerical simulations.4)A dynamic thermal management scheme based on the microfluidic cooling and ML method for 3-D integration is proposed.The modeling and simulation method of a 3-D IC with integrated microfluidic heat sink are firstly discussed.Then the ML-based control method is proposed and the calculation complexity of the algorithm is analyzed.Finally,using the simulation to imitate the real system,the effectiveness and feasibility of the proposed scheme is validated.