High Backplane Interconnection Study

In telecommunication and data communication, backplane is not only the less developed part of the technology, but also the more expensive part considering the cost of equipment development. It has become one bottleneck which blocks the further increase of the data rate. It is a great challenge that the electronics industry faces to improve data rate, and the development of high-speed circuit and the simulation technique have converged to a same point: the design of backplane.The application of electromagnetic field theory is sophisticated in the field of microwave. With the continuous increasing of the interconnection clock frequency, the skin-effect, dielectric loss and radiation loss become obviously in the interconnection. They caused by the limited rate and the fluctuating phenomena of electromagnetic field. The circuit theory that applied in the low frequency interconnection has become weakness. Today, more and more people begin to study how to solve the interconnection design's problems using the electromagnetic field analysis theory. High-speed digital interconnection has become a new application field of electromagnetic field theory.For the difference of signal property and transmission patterns, the mature design method of microwave can not be used in the field of interconnection directly. The correct method is: giving the practical situation, establishing a logical physical model, simplifying electromagnetic field theory, using the full-wave simulator to extract the parameters, to achieve an integrated simulation scheme. Guided by this principle, the crosstalk, differential pair and radiation of interconnection have been discussed in this paper.In the first chapter, the present status and research significance of high-speed backplane are investigated and how to calculate the bandwidth of a digital signal is introduced. At last, this chapter expounds the theoretical foundation of employing the electric magnetic field theory in the high-speed interconnection.Paper details the physical essence and characteristics of high-speed interconnection in chapter 2 and 3. Furthermore, the bandwidth of signal is divided into distinct performance regions, and these chapters have made a detailed analysis to the characteristics of interconnection inside of each performance region.Chapter 4 is more focused on the crosstalk of multi conductors. Multi conductor capacitance matrix and inductance matrix can be obtained based on electromagnetic calculation, and the crosstalk noise, spacing between adjacent signal lines, guard line are discussed detailedly.The Chapter 5 is about the differential pair. First the characteristic impedance and the ability to resist crosstalk of differential pair are analyzed. At last, electric-field distribution compared to the dielectric distribution is discussed.In the last chapter of this paper, chapter 6, the common-radiation is introduced. Based on the single-end interconnection and differential pair models, the specific mathematic representations of common-radiation are deduced. The results can describe the characteristics of common-radiation clearly and have the certain guiding sense regarding the high-speed backplane appraisal.