| Semiconductor devices inevitably cause damage in the production and use process,especially for flexible electronic devices,long-term bending will cause mechanical damage inside the device,which greatly affects the performance of the product,and the damage types are various and complex.It’s very difficult.At present,acoustic wave,optical probe,deep learning and other methods have been studied for semiconductor damage detection,but there are still problems such as low detection efficiency,limited volume of detection objects,and inability to achieve internal damage detection.A real-time,non-destructive,fast and wide-range damage detection method is urgently needed.Compared with visible light holography,infrared holography has the advantages of low stability and strong penetration.Microholography can achieve target zoom,zoom range is large,image clearer.Based on the transmission effect of semiconductor materials to infrared light,combined with the advantages of infrared microdigital holography,a semiconductor damage detection method based on infrared microdigital holography was proposed.In this paper,semiconductor silicon wafers(silicon wafers that are purposefully manufactured and contain a lot of damage)were studied.The main work and advantages are as follows:(1)Learn holographic knowledge,summarize infrared characteristics,and lay a theoretical foundation for experimental research.Understand the infrared properties of silicon,the wavelength range of infrared light transparent to silicon materials,and review the existing experimental conditions can be completed.(2)Verify the transmission rate of infrared light to silicon through the experimental method,design the experimental scheme based on holographic knowledge,construct the experimental optical path,and constantly improve the experimental optical path to achieve the best contrast of holographic interference fringe,and collect the hologram of the damaged silicon chip.(3)Image enhancement algorithm is used to further improve fringe contrast to obtain better data effect.Image processing is used to display the amplitude and phase information of the hologram respectively.Compared with the experimental data,the damage area can be observed by amplitude and phase information,and the damage situation is consistent with the actual situation.Compared with the amplitude information,the phase information is clearer and can judge the damage location,damage affected area,damage depth and other information.Advantages,verify the feasibility of the study,has a good detection effect;Visible light can’t do it.(4)In various research fields,infrared holography and microscopic holography were combined for the first time to detect damage.The optical path of this method can be reused,convenient,efficient and real-time,and the detection size is wide.It can judge damage conditions(location,affected area,depth and other information),achieve internal and external damage detection of equipment,batch detection and other advantages. |
