High Frequency Integrated Design Of 5G Millimeter Wave

Heterogeneous integration is the most advanced and promising technology in the field of chip integration.It can effectively improve the integration level while meeting the requirements of chip miniaturization.This subject has conducted related research on the 2.5D/3D packaging technology with silicon substrate interposer to achieve chip interconnection in heterogeneous integration technology.First,this article introduces the key technologies and technical principles involved in the design of the silicon-based heterogeneous integrated package structure,and the theory is verified through software simulation.Designing the RF port on the silicon substrate interposer,and obtaining the best structure through simulation analysis.Then,according to the designed ports,the package structure under the two working states of the transceiver chip is simulated and analyzed,and the size of the cavity on the silicon substrate interposer is optimized.Finally,the DC port and cavity are designed to complete the design of the entire package structure of the transceiver chip.Design the package structure of the transceiver multi-function module.Since the transceiver multi-function module needs to realize the interconnection between the chips,the key of the design is the adapter structure on the silicon substrate interposer.This article obtains the optimal structure and size of the adapter structure through simulation analysis.Then designing the RF port,DC port and cavity to complete the design of the entire package structure.Aiming at the problem of poor heat dissipation performance of the silicon-based heterogeneous integrated package structure,a structure in which low-resistance silicon wafers are mounted on the back of the chip to enhance heat dissipation is studied.Finally,testing and verifying the package structure of the through line and the transceiver chip after packaging.Comparing the through-line test results and simulation results after packaging,the two working states of the transceiver chip package structure were tested respectively,and indicators such as small signal gain,standing wave,P₁ power and noise figure were obtained,which verified the excellent performance of the package structure.