The Research Of Wet Etching Process For Micro 3-D Oscillator On Silicon Substrate

In recent years,hemispherical resonator gyroscope(HRG)has shown good performance and robustness in inertial navigation applications.However,the HRGs currently in use are in large volume and cost highly,which limit their application in navigation,space exploration and other fields.Therefore,for its small size and low cost,MEMS HRG has become an alternative choice having to consider.So,firstly we need to create an ideal hemispherical shell resonator structure.Recently,the craze of producing silicon 3-D hemispherical shell structure has been slowly rising in this field.With the process developing,it also makes manufacturing hemispherical resonator and other similar resonators become possible.This paper is a pre-inquiry mainly for the production of one kind of micro 3-D silicon resonator structure,which will make a good preparation for producing the corresponding resonator gyro in the future.Specifically,it is mainly for the production of one kind of birdbath structure with wet etching method.We study the etching agent ratio,etching window size,stirring rate and other factors that affect the etching of this kind of structure.It is also related to the selection of mask layer.The specific problems encountered in the etching process were discussed and analyzed.Finally,we get the preliminary etching birdbath structure.We use a variety of instrument to do the test and analysis,such as optical microscope,surface profiler,scanning electron microscope and so on.From the test results,the etched structure has reached the preliminary expectation.Subsequent experiments will do some optimization in order to achieve better etching results.All the work completed will lay the beneficial foundation of producing the corresponding thin film resonator as the next step in the future.