Microstrip Array Antennas Based On Mems Silicon Substrate

The technology of the space communication node is the supporting technique of the advanced aircraft in modern society. Its advancement has a direct effect on the proprieties of the aircraft, which is very significant under the tense international situation. At present, the most important problem concerned by the people is the light type of the aircraft, which can improve the speed of the aircraft efficiently, decrease the driving force, enhance the comprehensive proprieties, and decrease the manufacturing cost of the aircraft and so on. At the same time, it is quite essential to make the each part of the carrier light type in order to make the air vector carry more effective loads and play a more important role in the comprehensive proprieties. As the indispensable and key components of the aircraft, the light type of the space communication nodes plays an important role to the light type of the aircraft.With the development of the IC technology and the existence of the large number of isolated components of the RF front-end, it is difficult for the communication nodes to effectively reduce the volume and weight by utilizing the traditional integrated technology. However, the MEMS technology developed during the 1990s provided a solid basis for the light type of the space communication node equipments. The various advantages of the microstrip antenna, such as the small size, light weight, low profile, easy integration with the vectors, and good compatibility with the integrated circuits, etc. make it be widely used in the space communication.This research subject is gotten from the military pre-research project of the'11th five years'plan'air communication node technology'. The main work is research of X-band microstrip patch array antenna, whose emphasis is to realize the light type of microstrip antenna and even the communication node by the premise of guarantee of antenna's power capacity and communication distance. The transmission-line model, cavity model, full-wave analysis theory and finite element method which are often used in the analysis of microstrip antenna, are introduced. In order to be integrated with RF front-end using MEMS technology, and making use of RF-MEMS switch's superior mechanical and electric properties, antenna uses silicon as its substrate. Because silicon's dielectric constant is very large, which will worse radiation pattern. We use the method that digging a cavity to form double-layer substrate to decrease the dielectric constant. This paper designs the microstrip patch antenna based on the formulas derived from transmission-line model, and calculates the size of corner cut according to circular polarization theory. By simulation in HFSS, we get the drawing sheet of microstrip patch array antenna finally.