Research On Parameter Measurement System Of High Voltage High Power Semiconductor Device

Power electronic technology is based on power electronic devices,which determines the development of electronic power devices.Among all power semiconductor devices,IGBT is undoubtedly the fastest growing and the most concerned one.There are many parameters in IGBT,which affect the dynamic performance of IGBT.At present,most systems only measure and analyze the parameters of IGBT module,and the measurement speed is relatively slow.Aiming at the parasitic capacitance parameters of IGBT,a fast automatic measurement platform is designed to quickly judge the switching speed and switching loss of IGBT.The system realizes the rapid measurement of the module by pneumatic method,and realizes the switching of each measurement point by the relay controlled by the single chip microcomputer.Finally,the parameters are summarized and summarized by the PC software written by VB.NET.The following is the main work of this paper :1.The research and development process of power electronic semiconductor power components are introduced,and the basic structure,development and application of IGBT are briefly described.Then,the measurement scheme of capacitance parameters of high-power semiconductor module is studied,and the matters needing attention in the selection of measurement equipment are emphatically discussed.At the same time,the test method and measurement attention of capacitance parameters of high-power module are proposed.2.The overall design of the mechanical structure of the parameter measurement system of IGBT module is carried out by PRO / E software,and the related research is carried out on the feed module,the lower pressure module and the measurement module,respectively.At the same time,the whole process of measurement is simulated and operated.3.The internal structure of the measurement module is studied,and the measurement points required by the single chip microcomputer are designed.Then the layout of the schematic diagram of the hardware circuit module is completed,and the PCB board is finally realized.4.After the overall structure of the system is planned,the design process of the hardware driver is introduced from the initialization module,the logical operation module and the data sending and receiving module,and the function and use of the key components are discussed in detail.5.The software of high voltage and high power semiconductor devices is developed and designed.According to the modular development mode,the interface,data acquisition,communication protocol and file format conversion modules of the software are designed and analyzed.