Research On System-in-package Technology Of RF Transceiver Front-end

At present,with the development of semiconductor technology,various packaging technologies are emerging.System in package(SiP)stands out in a group of packaging technologies by virtue of its high integration characteristics and the convenience in combination with other processes,achieving multi-functioning and miniaturization of equipment.Compared with the traditional 2D packaging,the 3D SiP improves the interconnection density,has better signal transmission performance and chip performance.The paper studies technologies related to applying 3D SiP to RF transeiver front-end.In order to realize the SiP of RF transceiver front-end,this paper first discusses the structure of transceiver.After comparing with many types of transceiver structures,we choose superheterodyne receiver and superheterodyne transmitter as RF front-end structure.Then,the index of SiP is analyzed,the link is calculated,and the three-dimensional structure of packaging is designed.For SiP,the main issues are the connection and shielding of components.The paper focuses on the interconnection structure in the package.The design features many types of structures for the same plane interconnection and the inter layer interconnection.These structures have good signal transmission ability in the working frequency band,achieveing the goal of low insertion loss interconnection.Then,the isolation measures are studied,and the heat dissipation and reliability of the package are discussed.At last,the SiP of RF front-end is tested.Test result indicates that the packages excels in high integratoin,small size,signal output stability and many more.