Arch And Design Of RF Transceiver Based On System-in-Package Technology

With the improvement of information technology requirements in modern warfare,the new generation module is required to have the characteristics of multifunction,high performance,and rapid development.However,traditional microwave components still link the PCB circuit board with the packaged components through connectors.With the increase of system operating frequency,complexity and reliability requirements,these traditional processes have been difficult to meet the requirements of high performance complete machines.Chips with different functions can be installed in various forms by system-in-package technology.The three-dimensional structure is adopted to construct the chip,which greatly reduces the volume and weight of the system.RF receiving and transmitting module is studied and designed based on the 3D integration technology.The design adopts three-dimensional vertical interconnection and Package-on-Package stacking technologies to realize the function of up and down frequency conversion from 8.5 to 9.5GHz.The module includes amplifier,mixer,filter and attenuator,and it has the characteristics of high performance,low power consumption and high integration.The co-simulation ensures that the module has good electrical performance and heat dissipation performance.The main contents of this paper are as follows:1.The overall scheme of the module circuit is established,and the key indicators such as spurious suppression,small signal gain and noise figure are analyzed,and according to the analysis results,the circuit scheme of receiving circuit,transmitting circuit and frequency source is designed,and the key indicators are simulated in the simulation software.2.The circuit model of the vertical interconnection structure is analyzed.The echo loss and insertion loss of different interconnection structures are analyzed to optimize the circuit design.3.Then,the circuit layout design is completed,and the signal crosstalk simulation and thermal simulation are carried out on the circuit.According to the simulation of results,the circuit design is optimized to improve the signal transmission quality and the heat dissipation performance of the circuit.4.Finally,the transceiver module of X-band is developed and tested,which is integrated in a package with a size of 25.6×20.8×3.8mm.According to the test results,the gain of the receiving circuit is greater than 33dB,the noise figure is less than 11dB,and the spurious suppression is greater than 55dBc;the gain of the transmitting circuit is greater than 9.5dB,and the output power is greater than 4dBm;the phase noise of the frequency source circuit is less than-95dBc/@100kHz.