Research And Design Of W Band Sparse Array And Antenna In Package

With the development of mm-wave(millimeter-wave,mm-wave)technology,mm-wave has been widely used in the applications of high-speed communication,high-resolution imaging,and high-precision guidance.To obtain wider bandwidth,higher data transmission rate,and smaller size,the working frequency of the mm-wave system is increasing.In the high-frequency band of mm-wave,especially in the W-band,affected by high loss and market-demand for low cost and high integration,mm-wave systems encounter many difficulties and challenges in the design of high-performance array antennas and the implementation of high integration systems.Therefore,it is of great significance for the development of millimeter wave technology to research on Wband array antenna and AiP(antenna in package,AiP).The main contents are summarized as follows:1、Research on optimization technology of mm-wave sparse array: a novel optimization algorithm of sparse array based on improved genetic algorithm is proposed to improve the search ability and convergence;Based on the high-performance algorithm,a W-band monopulse sparse array antenna and a W-band active phased sparse array antenna are proposed.The distribution of array elements is optimized based on the proposed algorithm to achieve low sidelobe level and narrow beam;Then,a low-loss irregular waveguide interconnection network is designed to realize the conversion between the irregularly distributed sparse array elements and the regularly distributed feed ports,which is also the key component to the implementation of the sparse horn array antenna.The simulated and measured results demonstrate the high performances of the sparse array algorithm and the W-band sparse array antennas,which provides a valuable reference for the optimization theory of mm-wave sparse array and the design of W-band active phased array antenna with low cost and high performance.2、Research on vertical interconnection technology for W-band packaging process: the transmission principle of signal vertical interconnection structure is researched,including several commonly transmission line theory and quasi coaxial theory.Based on PCB process and siliconbased 3-D integration process,the W-band vertical interconnection transmission structures are proposed to realize the interconnection between antenna and active RF circuit.The simulated and measured results demonstrate the good performance of the proposed vertical interconnection transmission structure,which will be useful for the design of the signal vertical interconnection structure in W-band AiP.3、Research on W-band AiP based on silicon-based 3-D heterogenous integration process: a novel AiP scheme based on silicon-based 3-D heterogenous integration is proposed.In this scheme,the different substrate materials are stacked by silicon-based 3-D heterogenous integration process,and high-performance array antenna is realized;A cavity is designed in the silicon substrate to place the W-band chips to reduce the interference between the chips and other signals.Based on the proposed scheme,a W-band 2 × 4 passive antenna array is designed.After testing,the good performance of the array antenna and the feasibility of the AiP scheme are verified;Then,the research on the active phased AiP is carried out,including the analysis of the influence of the phase error on the beam pointing in the active phased array system,the research on the active RF frontend integrated system and the research on the near-field test methods of active phased array.Finally,a W-band active phased AiP array is proposed,and the measured results demonstrate its high performances.4、Research on W-band AiP based on HDI process: The characteristic of HDI process is introduced,and a novel W-band AiP scheme is proposed based on HDI process.In the scheme,the W-band chip is soldered at the bottom of the multilayer organic board with flip-chip configuration;The antenna is printed on the top of the organic board and designed with parasitic patches to achieve the high performance;A low-loss vertical interconnect structure is designed to realize the interconnection between the chip and the antenna.The sparse array optimization algorithm is used to optimize the positions of the antenna elements,which not only realizes the layout matching of the antenna array and the W-band chip to obtain the scalability of the array,but also realizes the large-angle beam scanning of the phased array antenna array.The measured results demonstrate the excellent beam scanning performance of the AiP,which provides a valuable solution for Wband active phased AiP to realize large-angle scanning.