Signal Integrity Analysis Of High-frequency And High-speed Hybrid PCB

With the development of the fifth generation communication technology,higher requirements are put forward for the data transmission volume and speed,which makes the communication PCB towards to the direction of high-density interconnection and high signal integrity,at the same time,it also puts forward new challenges to the existing PCB manufacturing technology.In the traditional PCB manufacturing process,if the low-frequency board is used to all,its performance can not be guaranteed,but if the high-frequency board is used to all,its performance can be guaranteed but its cost is expensive.Therefore,the hybrid structure of high-frequency board and low-frequency board can not only meet the needs of high-speed signal transmission,but also meet the needs of integration in the product assembly process,so as to reduce the cost of PCB processing and assemblingIn this paper,aiming at the problem of signal integrity in the high-frequency and high-speed hybrid PCB,based on the in-depth analysis of the signal integrity problem and the transmission line theory,the electromagnetic field effect of the high-frequency and high-speed hybrid PCB structure is simulated by the three-dimensional electromagnetic field simulator,and the linear structure setting and material selection of the transmission line in the high-frequency and high-speed hybrid PCB are studied and analyzed.Therefore,this paper studies the above problems,and the main work is as follows1.Aiming at the problem of signal crosstalk in high-frequency and high-speed PCB,taking the coupling capacitance and coupling inductance between two transmission lines as the optimized parameters,a differential transmission line structure T-type differential transmission line is proposed to improve signal crosstalk.Then,the orthogonal experiment method is used to study the influence of multiple parameters of T-type differential transmission line structure on the far-end crosstalk,determine the importance and primary and secondary order of these parameters to improve the crosstalk,and obtain the optimal combination scheme to improve the far-end crosstalk2.Aiming at the factors affecting the loss characteristics of the high-frequency high-speed integrated hybrid PCB during transmission,the insertion loss is taken as the analysis index,and the simulation analysis is carried out from the aspects of substrate thickness,material characteristics,so as to find the optimal design scheme of integrated hybrid structure that can minimize the adverse effects,so as to guide the design of integrated hybrid PCB and ensure reliable high-speed data transmission.3.Aiming at the problem of signal reflection caused by the discontinuity of the interface of the high-frequency high-speed local hybrid PCB,through the research and analysis of the reflection formation mechanism,the mixed mode S parameter is used as the inspection index.The linear structure at the junction of the local hybrid PCB is designed and analyzed by the method of modeling and simulation,and the influence of the discontinuity in the local hybrid structure on the high-speed signal transmission is understood,and providing guidance for the optimal design of the surface routing of the high-frequency high-speed local hybrid PCB.