The Experimentation And Research On Thermal Contact Resistance Of LSI

The Information Science is the core of technologies on national economy, which can be used in any fields of national economy, of which the Micro-electronics Technology is the key.With the rapid development of the Chinese economy, the information industry have a great development. At present, China has been the largest country which has the farthest increscent potential on consuming electronic products in the earth, the largest market of mobile telephones, the third largest PC market, and will be the second largest semiconductor market in the whole world in the future 5 years.The integrated circuit' cooling has been deeply researched, which is caused by the Large-scale integration's widely using. In the practice, people found that the lost of heat can not be ignored. In the fields of electronic technology, the heat transfer problem of electronic product includes heat transfer between integrated circuit and its submarine in chip as well as the design of heat removal on chip's crust, when the environment is given. The thermal contact resistance between integrated circuit and the cooling is the main one of the factors which decreases the efficiency of cooling, and buffers the heat transfer, which affects the CMOS chip' parameters and reliability. So finding and testing the affecting factors is significant to increasing the efficiency of cooling and saving the power.In this dissertation, we chose the thermal contact resistance between CPU and the Cooling as the object to experiment and research. First of all, we analyzed the heat transfer process, on which the thermal contact resistance has great effects.The experimentation is the base of research on thermal contact resistance, when did the experimentation on the thermal contact resistance between LSI and the Cooling, automatic data collecting and control is the basal problem. We designed and developed the hardware and software of multi data collecting system independently and detailed analyses and discussion about temperature sensor's selection, fitting of sensor, amplification of weak signal, high precision AD conversion, and so on, then we developed the software based on Lab View7.0.When calculate the thermal contact resistance, the heat power is the important parameter, so we constructed the equipment which is used to measure the heat power of CPU that we chose. We got the heat power of the CPU based on the equipment. With the parameter collected by the multi data collecting system, we could calculate the thermal contact resistance at last.Then, we found the factors which affect the thermal contact resistance between CPU and the cooling by changing the experimental condition and the kinds of loads. Later we did qualitative analysis on the factors and analyzed how the factors affect when the heat transfer happened.