Control System Design Of Diamond Wire Cutting Machine

Silicon wafer cutting is an important process in wafer processing,because it is widely used in large-scale integrated circuit and photovoltaic power generation industry.Therefore,it is of great significance to design a set of linear cutting control system with high efficiency and large output.At present,there are mainly free abrasive wire cutting,diamond wire cutting and other silicon cutting methods.Because diamond wire cutting has the advantage of high cost performance,it is widely used.In this paper,a control system of diamond wire cutting machine which can cut the silicon rod is designed based on PLC.The following contents are mainly completed.Firstly,the development current situation and research significance of diamond wire cutting control technology at home and abroad are elaborated,and the main research contents of this topic are summarized.The second: According to the mechanical structure of the diamond wire cutting machine,design a suitable control system scheme,and elaborates on the control system taking part,row line part,feeding part,main control unit and the display part,the tension compensation part needs to be done,computing choose the component models.Thirdly,the control system input and output part,tension compensation part,controller and drive motor and other hardware parts are designed and developed,and the entire control system wiring diagram is designed.Fourthly,the software part of the control system is designed.Based on DOP soft,a touch screen monitoring interface with automatic/manual mode is designed,which can monitor the tension of diamond wires and realize real-time speed adjustment.Based on TAI DA ISP Soft,the control program of wire cutting system can realize the accurate control of the feeding motor and the line motor.