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Design Of Computer Case Incorporating Thermal Simulation Analysis Module

Posted on:2021-02-07Degree:MasterType:Thesis
Country:ChinaCandidate:P DanFull Text:PDF
GTID:2428330626962801Subject:Industrial design engineering
Abstract/Summary:PDF Full Text Request
With the continuous upgrade of desktop computer configuration,the degree of integration has become higher and the performance has improved,resulting in a sharp increase in the amount of heat generated by the electronic components inside the computer host.It is necessary to optimize the heat dissipation of the structure and design the chassis.This article is the system design for the computer case,which integrates the thermal simulation analysis module with the product shape design,making the design more scientific and rigorous.This article first uses the user survey method and literature collection method to dig out user needs and have a deep understanding of the basic knowledge of the chassis;based on the survey results and literature review,Solidworks is used to design the chassis simulation structure,and three preliminary structural layouts are obtained;secondly based on Thermal simulation analysis principle,using Solidworks Flow Simulation to conduct heat dissipation simulation experiments and analysis on the above chassis structure schemes,and found that there are problems such as air flow loss,air vortex and recirculation;for this,the conventional scheme and scheme one with excessive temperature are eliminated,and TRIZ is adopted.The theory analyzes and solves the problems existing in Scheme 2 and Scheme 3,and optimizes its structure.The optimized structure is again subjected to heat dissipation simulation experiments.The results show that the problem is solved and the heat dissipation effect is significantly improved;finally based on the optimized structure Carry out the appearance and structure design of the chassis to obtain an innovative computer chassis with a combination of sensibility and rationality and good heat dissipation performance.This article organically integrates thermal simulation analysis into product modeling design and discovers the main reason for the formation of air ducts inside the chassis;using the analysis results to modify the structure and modeling to achieve the unification of modeling design and structural optimization;and finally to meet user needs and functional requirements Computer chassis design.
Keywords/Search Tags:Chassis design, Thermal simulation, Flow Simulation, optimized design
PDF Full Text Request
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