Design And Optimization Of Packaging Technology Based On SC70 Molding Device

At present,automotive electronics has become a new breakthrough point in semiconductor industry and the increment is rapid,the pattern of semiconductor industry will be further changed.The important role of packaging technology is to protect the functional integrity of the circuit,and one of the core technologies of packaging technology is molding device.With the rapid development of semiconductor industry,molding device technology has been maturing,and the maturity of molding device technology will directly affect the service life of itself.Molding device are non-air-tight packaging,easy to absorb water vapor in the environment resulting in corrosion and delamination problems.The thermal expansion coefficient of each raw material that makes up the molding device is very different,which leads to the greater stress inside the device.A large number of studies have been carried out to simulate the internal stress and discuss the principle of moisture,which can be used to solve the delamination problem and improve the reliability of the device.But in the actual production process,the reasons that affect delamination and reliability are intricate.The SC70 packaging products in this paper are made of Epoxy Molding Compound lead frame,chip and copper wire.In order to solve the delamination problem of SC70 packaging products on the production site,improve the quality of the products,and expand the customer base of the company's automotive electronics products.Aiming at the delamination phenomenon of SC70 molding device,the paper analyzes it synthetically by experiment,and takes measures to improve the delamination problem.Focus on the SC70 molding process,through the optimization of the process design to achieve the key functional area zero delamination.Based on the research object of SC70 molding device technology,this paper studies various materials,material matching and process parameters of molding device,and then synthetically analyzes the actual situation of production site to find the solution of optimizing process.Through the element composition analysis of the lead frame to understand the oxidation of the surface.By X ray and device opening analysis to understand the internal situation of the device.The delaminated position was detected by ultrasonic scanning microscope,and then the cross section of the sample was ground to the specific position.Then the specific position was enlarged and imaged by scanning electron microscope to understand the contact interface of Molding Compound,and finally the shape and direction of the crack were observed.Refer to the common proportion and function of Molding Compound,to understand the different composition of Molding Compound to improve the problem of delamination.By referring to the relevant literature,the experimental scheme of analyzing the root cause is formulated,and the measures to improve the product quality are put forward.The optimization measures in this paper are to replace the Molding Compound with higher viscosity and to increase the adhesion between Epoxy Molding Compound and lead frame.Change the lead frame design,redesign the angle and quantity of the V resistance liquid tank,prevent the crack from extending to the inside of the device,and avoid the external water vapor intrusion into the inside of the device.The optimum process parameters of molding device were determined by experiment design,and the defect rate of molding process was reduced.Above optimization scheme will lead to the change of the stress and strain of the device.The internal and external temperature distribution and stress strain of the SC70 molding device are simulated and analyzed by finite element software.Finally,the improved samples were verified.