Improvement Study Of Delamination Of Lead Frame Products For Integrated Circuit Package

Researching into the fields of integrated circuits, the delamination is defined as acommon kind failure. Compare with substrate products, lead frame products have higherrates of delamination. Delamination will cause the degradation problems of electricfunction or reliability, such as the Popcorn.The dissertation has two goals:1) to search and then list factors for delamination soas to guide on right direction;2) in deep to summarize the improvement of delaminationbased on our actual cases. Five blocks are within this paper:1. Outline the process flow of assembly&packaging and the methods of failureanalyses;2. Classifing the factors of delamination;3. Analyze the pros of improvements;4. Verify above techs of improvements;5. Summarize the effects of improvements.The results show that the most commonly used methods, in decreasing power orderof performances cost ratios, include plasma cleaning, minimizing the silvering area,roughness lead frame, chip position shifting to pad center, optimizing the parameters ofmolding. Through these methods85%of delamination can be solved. If above methodsare not very effective, please use next two methods, respectively: to optimize thecompound components and package architecture.Key conclusions believe what this packaging case studies show may be that corespicked up embracing the Kilby Rule.