Discrete Device Of Delamination Problem Research

At present, the delamination still is a major concern in terms of quality andreliability for lead frame packaging. How to avoid the cause and promoting yield rate inwhich to become a very important issue and need to be improve at continuously. Thispaper demonstrated by experiment and reappeared deviation for delamination to beverified. Finally, to obtain the optimum parameters and research for determining theroot cause and these viewpoints have a positive efficiency for process improvement tocontrol the delamination occurrence.This paper were mainly researched to addressed the occurrence of delaminationphenomenon between the interface of epoxy molding compound (EMC) and the leadframe during assembly process. Temperature in wire bonding process, moldingparameter and molding material is the main factors that influence delamination byfishbone diagram. According to the three main factors, I designed three partexperiments. The first part is Design of Experiments (DOE) for mold diagram; thesecond part is simulating wire bonding process; the third part is cross-over designbetween three type mold compounds and two type lead frames. Continue topreconditioning after molding; check the delamination phenomenon with C-ModeScanning Acoustic Microscope and Scanning Electron Microscopy methodology. Basedon experimental results and combined with relevant literature, several measures for theplastic packing devices reliability are improved. Finally, analysis the experimentalresults, the most important cause for device failure is brought out, and some effectivemeasure avoiding the device delamination...