Preparation Of Epoxy Molding Compound Used For Large Scale Integration Packaging

In this paper, the formulation, preparation process and performance of epoxy molding compound used for LSI packaging was studied. According to the experimental requirements, a set of experimental equipment for the preparation of epoxy molding compound was selected, the press cake mold, spiral flow mold, bending and flame retardant properties mold, linear expansion coefficient mold and dielectric properties mold were design and process designed and processed.The kinds and contents of each component in the EMC samples EC-15L and EME-1100 were analyzed. EC-15L was filled with about 79% particle size 1-50μm molten irregular silica powder, and EME-1100 was filled with about 83% of the particle size 1-10μm partially crystalline irregular microsilica. The matrix resin is a o-cresol formaldehyde epoxy resin, and added Sb2O3 as flame retardant.Selected o-cresol formaldehyde epoxy resin as matrix resin, triphenylphosphine and 2-methyl imidazole as curing accelerator agent for the preparation of an integrated circuit packaging epoxy molding compound, and cured products were tested by TMA and DMA. Compared to the 2-methyl imidazole system, the curing reaction degree of triphenylphosphine was lower, the crosslinking structure was incomplete, and showed a lower glass transition temperature.The non isothermal DSC method was used to study the curing behavior of o-cresol formaldehyde epoxy molding compound and biphenyl epoxy molding compound. For the system with a high amount of phenolic resin, the activation energy of the curing reaction is significantly less than the system with a low amount of phenolic resin; The system selected 2-methyl imidazole as accelerator had a lower curing activation energy; The system with high amount of 2-methy limidazole its activation energy of the curing reaction wass substantially less than the system with low amount of 2-methy limidazole, use a longer pre-curing time, the late exothermic heat in the curing process was small; Pure biphenyl epoxy resin curing system had low activation energy, with the increase of biphenyl epoxy resin content, the reaction activation energy of curing system was reduced, but the gelation time extended.Increasing the content of silicon powder will result in deterioration of the fluidity of epoxy molding compound; Increasing the injection pressure can increase its density, flexural modulus and flexural strength, increasing curing time, the mechanical properties of the samples improved significantly; Fillers can increase the glass transition temperature, heat resistance and mechanical properties of the polymer matrix material; The extract of Biphenyl epoxy resin molding compound showed a weak acid pH value, the content of Cl" is less than 7×10-5mol/l; Increasing the spline density reduced water absorption, water absorption of each system in this experiment were less than 1%, showed good moisture resistance performance; The dielectric properties of system can meet the requirements.