Design And Implementation Of Fh0189 Thermal Resistance Testing Method

More and more electronic devices are used in more harsh environments,and these devices are becoming more and more intelligent so that they can fulfill the tasks assigned to them.The intellectualization of devices is partly attributed to the development of integrated circuit technology,which also brings many challenges to integrated circuits,such as higher power,higher frequency and higher integration.These challenges also bring about an unavoidable problem,that is,how the heat generated by integrated circuits can be transferred outward to make them operate normally in an appropriate temperature range.The accumulated heat will lead to the increase in device temperature,the decrease in device performance and the increase in failure rate.According to a failure analysis from Avionics in the United States,55% of the failure causes of semiconductor devices are temperature-related,which shows the importance of controlling the temperature of semiconductor devices.To deal with the high heat problem of high-power semiconductor devices in engineering applications,theoretical calculation is generally used to calculate the dissipation power of the required radiator.This method may lead to unreasonable choice of radiator,such as: too large radiator takes up precious equipment space,too small radiator makes the device temperature too high and failure rate rise,etc.In this paper,how to evaluate the heat dissipation ability of integrated circuits in high-power applications is selected as the starting point.The definition of thermal resistance,the measurement of junction temperature and the measurement and calculation of heating power of high-power integrated circuits are discussed.The basic theory of thermal resistance test and the analysis method of FH0189 thermal resistance test circuit are mastered,and the design of FH0189 thermal resistance test circuit is realized step by step.This paper starts from several key parameters needed for thermal resistance test,and solves the three problems of chip temperature measurement,reference point temperature measurement and heating power measurement and calculation,then from diode,single chip package FH541 to dual chip package FH0189,from easy to difficult,gradually solves the problems in FH0189 thermal resistance test circuit,and finally completes FH0189 thermal resistance test circuit design and implementation.The main contribution of this paper is to design FH0189 thermal resistance test circuit through independent analysis of the design features of domestic devices,analyze the structural features of FH0189 reflected by the structural function,and compare the measurement results with the thermal simulation results to analyze the effectiveness of the measurement results.With the accurate calculation of the thermal resistance value and thermal characteristics of the device,the design of the radiator will be more scientific,which provides more abundant application guidance parameters for the application of domestic devices.