FH0189 Packaging Process Improvement And Reliability Research

The trend in electronic systems and subsystem packaging is to continuously reduce size and improve performance,a trend that can be seen in the increasing integration of semiconductors and the increasing use of hybrid integrated circuits and multi-chip modules.Placing more functionality in smaller packages leads to higher thermal density,so thermal management is required to be prioritized in the design to maintain the performance and reliability of the system.In this development trend,the author's company has undertaken a number of hybrid integrated circuits and multi-chip module development projects,due to the high packaging density,the packaging of thermal management and thermal design put forward higher requirements.FH0189 is the author's company's classic hybrid integrated circuit products,in various fields have a wide range of applications.With FH0189 as the research object,the study of thermal reliability is not only helpful to improve the pass rate of such products,but also helps to expand the research of new packaging materials,packaging technology,screening test and failure analysis technology,and provides valuable reference and technical methods for the thermal design and thermal management of new scientific research products.This thesis studies the thermal reliability of FH0189 and the improvement of packaging process.The main contents and findings are:1.The analysis and study of the circuit principle,package material and package structure of FH0189,and the techniques and methods commonly used in the failure analysis of microelectronic devices are summarized,which provide scant technical route for FH0189 thermal reliability analysis,i.e.electrolysis testing,non-destructive analysis and destructive analysis.2.To study the typical case of FH0189 thermal failure,the functional test of electrical test found that the device had thermal protection at the ambient temperature of 125 degrees C,and then found that the device welding hole rate was more than 25% in the xray inspection of non-destructive analysis,combined with the circuit principle of the device and the preliminary qualitative determination of the package structure of the device.The device is due to the welding hole is too large to cause the package to dissipate poor heat and the phenomenon of thermal failure.3.The principle and method of thermal resistance definition and thermal resistance test are studied,the method and circuit of FH0189 thermal resistance test are designed,the chip temperature and heating power in the thermal resistance test are measured,and the thermal resistance from the package to the shell is accurately measured by the transient dual interface method.Through the measurement of FH0189 thermal resistance parameters,the chip junction temperature under the application conditions of the device is accurately calculated,and the thermal failure caused by the large thermal resistance of the device is given,and the measures to improve the package welding process and the old refining test conditions are proposed.4.To study the FH0189 packaging material and process,the substrate bonding material is changed from the original silver tin alloy to the gold tin alloy,and the welding process is changed from alloy welding to vacuum alloy welding.Through the improvement of package material and packaging process,the welding hole rate and package thermal resistance of the device are reduced,and the pass rate of the product is improved.