| With the development of science and technology,product miniaturization has become an important direction of manufacturing industry,especially microelectronics industry,which has become the most important part of the development of national economy.As the front-end industry of microelectronics industry,micro packaging technology has been paid more and more attention by the state in recent years,and precision dispensing technology is the key link of micro packaging technology.Precise dispensing is a process of precise distribution of colloid in a controlled way.The accuracy of the glue drop directly affects the mechanical,electrical and thermal properties of the device.At present,the adhesive used in the packaging industry is developing towards high viscosity.Contact dispensing technology has a place in the packaging market by virtue of its advantages of precise distribution of high viscosity glue solution.In addition,the technology itself also relies on the characteristics of simple structure,low cost and convenient cleaning,which is more emphasized by the majority of packaging enterprises.With the trend of miniaturization and diversification of microelectronics products,it is urgent to find a more precise dispensing form.In addition,at present,there is almost no specific research on the influence of various factors on the glue spots.Therefore,this paper proposes a general micro dispensing method,and uses this dispensing method to carry out a variety of influencing factors for dispensing resultsIn this paper,the research background significance and application status of dispensing technology are introduced firstly.Then,from the perspective of fluid properties,the classification and comparison of glue liquid are carried out and the properties of glue liquid are described by mathematical model.The dispensing process is divided into three stages,and from the perspective of micromechanics,The paper describes the mathematical modeling of the tiny glue drops formed in the three stages(the adhesive drops on the tip of the transfer needle in the glue taking stage,the residual glue drops on the dispensing surface at the moment of the liquid bridge breaking in the glue dispensing stage,and the glue spots formed in the steady state of the dispensing surface in the glue forming stage).Through the model,the stress of the glue during the dispensing process and the formation of the glue spots is analyzed,and the factors affecting the dispensing results are determined.Considering the parameters of the experiment and the properties of the liquid and the material,the contact experiment prototype of the experiment was designed and manufactured.Through the experimental analysis to verify the influence of the influencing factors on the rubber spot,first the results confirm that the parameters in the mathematical model deduced do have an impact on the results of the rubber spot,and then confirm that the dispensing consistency of the experimental device is good.Under the condition of controlling a single variable,it is found that the size of glue spot will increase obviously with the increase of tip diameter of pipette,slightly with the increase of dispensing speed,and decrease with the increase of dispensing distance gap and viscosity.In addition,the change of different factors will also affect the dispensing quality.The tip diameter,dispensing speed and viscosity of the transfer needle will not affect the spot quality,but the increase of dispensing distance gap will obviously lead to the decrease of dispensing quality.At last,the paper analyzes the various abnormal spots and dispensing failure in the experiment,so as to further optimize the experimental work in the future.The results of this study will play an important role in the further research and application of precision dispensing technology. |
PDF Full Text Request