Wafer Transfer Manipulator Active Control Method Research Based On Pose Adjustment

Integrated circuit manufacturing equipment is the most important part of the electronic industry,promote economic development,promote social progress and speed up the construction of civilization.Wafer transfer manipulator is the core of the wafer transfer system,mainly used for fast,efficient and smooth transmission of wafer.Aiming at the requirement of high precision,high stability and high flexibility of the wafer transfer robot,research on improving the performance of wafer transfer manipulator by adjusting the position and acceleration of the manipulator under the condition of high speed.Based on the research on the working principle and performance requirements of the wafer transfer manipulator,the research on the manipulator motion control system and the research on the adhesion and friction between the wafer and the manipulator at the micro interface,the UG software is used to design and establish the position-adjustable wafer transfer manipulator model,and according to the manipulator model build manipulator platform.According to the coulomb friction theory and the JKR elastic contact theory,the change of friction and adhesion between wafer and the end effector is analyzed under horizontal position and position adjustment.Finally,the friction model and the adhesion model between wafer and the manipulator end effector are established,which lays the foundation for researching the active control method of the wafer transmission.According to the established platform of wafer transfer manipulator,the structure of manipulator is analyzed,and the supporting components of manipulator is optimized by ANSYS software.The kinematics coordinate system is established based on the D-H method,make kinematics analysis of the manipulator,and the kinematic equation of the manipulator is established by using the direct analysis method.Then make dynamics analysis of the manipulator,the dynamic equation of the manipulator is derived by using the Lagrange equation,and get the dynamic model of manipulator.The software ADMAS was used to simulate the movement of the wafer transfer manipulator.The acceleration anddisplacement characteristics of the wafer and the manipulator in different postures were obtained.The simulation results show that the wafer transfer acceleration can be effectively improved by using the position adjustment method,so that the wafer can be transferred efficiently and stably.Aiming at the research of motion control system of wafer transfer manipulator,the different control methods of manipulator are analyzed firstly,and the new method to realize the synchronization control between manipulator transfer platform and end effector is studied.Through the simulation of manipulator,the change of position and posture of the manipulator end effector is analyzed,and then the synchronization control method between the manipulator's horizontal movement mechanism and the end effector is analyzed.Finally,adopt the "PC + motion controller" wafer transfer motion control method.and establish the realization of high-speed motion in the horizontal direction while the end effector can adjust the pose of the wafer transfer motion control system.Finally,based on the experimental results of simulation,the experiment of motion control was carried out on the experimental platform.Experiments on wafer transfer under different acceleration and different pose were carried out to verify if the design of wafer transfer motion control system meet the wafer transfer requirements or not.And the data acquisition card and SDILogger software are used to collect and analyze the movement data of the manipulator platform.The feasibility and reliability of the wafer transmission motion control system are verified.At the same time,real-time feedback and motion control adjustment of the wafer transmission data acquisition are also realized Lay the foundation.