Design And Analysis Of End Effector For Wafer Transfer Robot Based On Acceleration Adjustment

The integrated circuit industry is the cornerstone and the core of economic development in the modern information society, wafer transmission system is the key manufacturing equipment in the integrated circuit industry, it has a decisive influence for the production efficiency in the integrated circuit industry. At present, wafer transmission manipulator, as key component in the wafer transmission system, all adopt the way of horizontal position transmission to transfer wafer, thus it determines the maximum acceleration for transferring wafer only providing by friction force from the gravity of wafer, which seriously limits the efficiency for wafer transmission. In view of the above problems, this dissertation studies adopting the way of acceleration adjustment to improve the efficiency of wafer transmission, mainly analyses the micro-adhesion mechanism of wafer transmission surface based on the acceleration adjustment, then designs the end effector based on acceleration adjustment, finally do simulation analysis of transmission performance for the designed end effector.Firstly, use the microscopic elastic contact theory, from the view of the ideal status ignoring wafer transmission surface’s micro-deformation, study the micro-interface adhesion mechanism of wafer transmission surface under the condition of horizontal position and acceleration adjustment, on this basis, study the micro-interface adhesion mechanism of wafer transmission surface under the condition of considering microstructure actual contact deformation; through establishing the microstructure mechanical model, finally get the corresponding calculation formulas about acceleration and adhesion force, lay the theoretical basis for the later design of end effector.Based on the micro-interface adhesion mechanism of wafer transmission surface, design the microstructure array of end effector, respectively analyse the deformation on cylinder microstructure array, cuboid microstructure array and cone microstructure array under the condition of horizontal position and acceleration adjustment, and the maximum acceleration along with the change of posture adjustment time providing by three kinds of structures, the analysis results show that the cylinder microstructure array has small deformation in the process of wafer transmission and it has better acceleration performance, then choose the cylinder microstructure array as the wafer transmission surface. Finally, on the premise of the minimum deformation of wafer, then establish the number of microstructure array of end effector.Based on the general design requirements of end effector, establish the preliminary design structure of end effector, then use the method of topology optimization design to optimize the preliminary design structure, then get the optimum structure of the end effector based on acceleration adjustment. At last, verify the rationality of the optimization result from the view of structural dynamics.Finally, establish the manipulator model for wafer transmission, then respectively use ADAMS to do simulation analysis about end effector with three kinds of microstructure array and comparatively analyse the transfer efficiency under the horizontal posture transfer and transfer by the way of acceleration adjustment. The simulation results show that the end effector using cylinder microstructure array has better adhesive performance, it also shows that wafer transmission by the way of acceleration adjustment can effectively improve the wafer transmission efficiency, its performance is superior to the way of horizontal position transmission.