Wafer Transfer Robot Control Method Research Based On Microscopic Mechanism Of Interfacial Adhesion

Integrated circuit(IC) manufacturing equipment is the basis of the electronic information industry, is one of the high-tech development to promote economic and social information. IC wafer transport manipulater is an important part of the equipment in wafer transport system, is mainly responsible for the precise positioning of wafers and fast, smooth handling tasks. This paper discusses the research status of the wafer transport robot, on the basis of analysis of microscopic interfacial adhesion theory, the study of the robot end effector in place an effective way to achieve high acceleration wafer transfer by posture adjustment. High acceleration kinematics wafer transfer motion platform, dynamics solving kinematics complete virtual prototype simulation methods for controlling, the wafer transfer high acceleration motion platform has been systematically studied. Based on wafer surface adhesion properties, transmission control method for high acceleration wafer transfer motion platform were studied. The main work:At the micro adhesion mechanism between end effector and the wafer, first consider the body structure of mechanical actuators, comparative analysis of a typical model and microscopic friction contact theory. Calculation wafer contact surface friction consider microscopic part of the friction force, according to JKR elastic contact theory, build a mathematical model for solving the wafer contact surface adhesion. Separately analyzed friction and adhesion properties of the end position and orientation of the horizontal, draw variation between the contact surface adhesion pose with angle. Further analysis of the relationship between the wafer transfer acceleration and the end effector pose angle, based on this research an effective way is concluded to achieve highly accelerated transport of wafers.After systematic analysis the requirement of high acceleration wafer transport movement structure and a method of adjusting the wafer transfer interface adhesion, create high acceleration wafer transport platform model. Firstly, the wafer transfer coordinates of high acceleration motion platform, analyzes the mobile transformation equations origin of the coordinate system; further study of the kinematic model highly accelerated transport of wafers built in coordinates, kinematic solving; and complete kinetic analysis based on the basis of body dynamics; application of UG establish three-dimensional model of each motion system components to complete the assembly of the wafer transfer motion platform, using ADAMS simulation software for high acceleration wafer transfer platform kinematics simulation, results show that the application of the end position and attitude adjustment method can effectively improve the wafer transfer acceleration to achieve fast and stable transmission wafer.According to the requirements of the highly accelerated movement of wafer transport system, study high acceleration control method of motion platform. Firstly, analysis common synchronized motion control structure, determine control strategies used in high acceleration wafer transfer motion platform; the horizontal motion platform provides high acceleration linear motion, while the driver of the end to achieve the pose angle adjustment; establish the synchronization control structure based on the acceleration adjustment, to ensure synchronized acceleration high acceleration wafer transfer process and the end effector pose corner. Wafer transfer process with high adhesion and low adhesion of the release of the wafer, to achieve fast and reliable transmission of the wafer.