The Measurement Technology Of 10Gb/s Photodetector

Optical transceiver module is the core component of optical fiber communication system.In the new era when 5G,cloud computing and big data are booming,the research and performance test of high-speed integrated optical transceiver module have very important practical significance.This paper analyzes the design idea and packaging technology of commercial optical modules.According to the existing laboratory equipment and experimental conditions,it studies the performance testing technology of photodetector chips,designs and develops semi-packaged photoelectric receiving modules,optimizes the testing system,simplifies the testing methods,and improves the testing efficiency.The main research work of this paper is as follows:1.We independently designed and built an experimental testing system to carry out experimental research on commercial photodetector chips and commercial optical modules,including DC characteristics,small signal characteristics and large signal characteristics,and to study the main performance parameters and packaging process.2.Two different circuit boards are designed to study the transmission performance of RF connectors.The effects of various grounding structures on signal transmission are studied through array boards.The signal transmission with a bandwidth of up to 9GHz is realized through iterative design.3.The impedance of transmission line is calculated by simulation,trapezoidal transmission line with grounded coplanar waveguide structure is designed,and double-layer signal transmission circuit board is developed to realize the input of working voltage and signal output of bare photodetector chip,and the noise source of output signal is analyzed.4.A four-layer signal transmission circuit board is designed,and a double-layer partition reference ground and a multi-section gradual change transmission line structure are designed.The signal transmission with the narrowest transmission line width of 8mil is realized,and the noise is basically eliminated.V-shaped groove is adopted to fix the inclined optical fiber,and the semi-packaged photoelectric receiving module is completed by matching the packaging related components,which can meet the packaging test of 10GHz photodetector chip.Fig.72,table 7,61references.