Package Design Of Multi-wavelength Laser Module

Since the 21st century, with the development of big data, high speed and high amount of information services have been emerging, which puts forward higher requirements both on the bandwidth of broadband communication network and on the active optical devices being used in optical networks. With the maturity of optical access networks and FTTH (Fiber To The Home) policy promotion, a small-size, high integration, low-power optical chip is widely needed. Photonic integration technology will become the development trend of the future.In recent years, Microwave Photonics Laboratory of Nanjing University has been working on optical chips. Under the leadership of Prof. Xiangfei Chen, the laboratory has made great progress in the theoretical innovation and experimental verification. We have developed a reconstruction equivalent chirp (REC) technology with independent intellectual property rights. Based on this technology, we have developed a highly accurate wavelength array chip, which has reached the leading level in the world. However, the bare chip can not be put directly into the market for application. In order to achieve higher performance, we should package it into an optical module. The optical module also includes some components and designed circuits. Most of the existing chips are separate, and their packaging technology is more mature. However, due to the novelty and uniqueness of the array chips, there is no packaging technology for them.The matching package technology of laser array chip developed by REC is explored in this paper. It mainly includes the design of the fixture size, coupling, microwave circuit and so on. First domestic REC technology based multichannel array laser module has been successfully developed. The basic performance test of packaged modules was taken to verify the feasibility of the REC technology and the REC array chip package technology.