Research On Staggered Superimposed Microchannel Heat Sink

With the rapid development of modern electronic technology,the performance of microprocessors and electronic chips has become more advanced,but their size is smaller,and they have higher integration and sensitivity.In addition,many electronic devices and systems have been miniaturized and integrated through microfabrication technology,which means that more heat will be generated per unit area,and the heat flux will be over 100W/cm~2.If the heat is not dissipated in time,the surface temperature of electronic chips will rise sharply.When the temperature exceeds 80?,the performance and life of chips will be seriously affected.The proposal of microchannel heat sink solves the heat dissipation problem of small size chips very well.Due to its compact structure,high thermal efficiency,high surface area to volume ratio and less need for working fluids,it is widely used in highly specialized fields such as high-power electronic cooling.In this paper,by summarizing the dynamic development trend of microchannel heat sink at home and abroad,based on hydrodynamics and heat transfer,a microchannel heat sink with a“?”-shaped structureis designed.The working fluid moves in rectangular wave trajectory,and under the same volume,the contact area between the working fluid and the surface of the radiator is increased,and the heat transfer performance is enhanced.The main work of this paper includes the following:Firstly,the composition system and working principle of the microchannel heat sink are introduced in detail.The spatial distribution of working substance particles and the factors affecting convective heat transfer in the process of heat transfer are qualitatively analyzed,and the corresponding mathematical model is established.On this basis,the numerical simulation of the microchannel heat sink is carried out to study the distribution of surface temperature and working fluid velocity under different conditions,and determine the optimal parameter value.Secondly,the technological parameters of the microchannel heat sink are explored through experiments and the manufacturing process is designed.The microchannel is divided into upper and lower layers.Then,stack it for packaging.Subsequently,metal nickel was sputtered at the bottom of the radiator plate as a simulated heat source to provide the heat needed for the experiment and effectively reduce the heat loss.Finally,an experimental platform was built to collect the data of working fluid flow rate,surface temperature and pressure drop,and the heat transfer performance and pressure drop performance of the microchannel heat sink were tested.The effects of working fluid flow rate on inlet and outlet pressure drop,convective heat transfer coefficient and friction coefficient were analyzed through experimental results.When the working fluid flow rate is 1.1m/s,the friction resistance coefficient tends to 0.45 and convective heat transfer coefficient can reach10~4W/(m~2·K).