The Research And Fabrication Of Microchannel Heat Sink Of Chip-Level Heat Dissipation System

Multi-Chip Module(MCM) is device which integrated with unpacked very large scale integration circuit(VLSI) and application specific integrated circuit(ASIC).With the decreasing of the channel length of transistor,more and more transistors are integrated on a chip.It causes large heat flux inside the chip,generating a large amount of heat.If the heat can't be transferred in time,the chip would work in inappropriate temperature.It decreases the life expectancy of electronic device or directly causes the failure of chip.Microchannel heat sink(MHS) is a potential heat dissipation method which is aimed at chip heat transfer.MCH has small dimension and high heat dissipation efficiency when compared with air cooling and macro liquid cooling.For the MCM,we can install MHS to transfer heat at where the chip locates,which will decreases the temperature of chip and heat pots in the MCM.It helps extend the life expectancy of MCM.The multiple heat sources MHS in the paper is based on the subject requirement to transfer heat from chip.According to the technical requirement,the heat flux of single heat source is required to achieve 500W/cm~2.At the same time,the temperature rise of the surface should be less than 50?.On the basis of hydrodynamics and heat transfer theory,use the finite element analysis method to simulate the heat dissipation performance of single heat source parallel MHS and the shunt structure of multiple heat source MHS.Based on the reason of energy loss and principle of convective heat transfer,analyze the simulation results and modify the model of shunt structure until the coolant is well-distributed in the MHS.It can guarantee the temperature uniformity of multiple heat sources.At last,according to the well-designed MHS and considering the problems in the process of fabrication,arrange the appropriate fabrication steps of MHS.After that,we chose the proper measuring apparatus to organize the testing system.In the experiment,the thermal infrared imager is used to monitor the temperature of surface,and the sensors are mainly measure the temperature inside the channels.Through the experiment,we verify that the MHS can afford the heat flux up to 500W/cm~2 and the temperature rise of the surface is less than 50?.When the four heat sources work simultaneously,the upper and lower distributed heat sources appear the temperature difference in the condition of low flow and large power because the limitation o f model design.This temperature difference can be decreased after increasing the flow rate.