The Research On X-Band Receiver Module Design Based On 3D Intergration Technology

As the rapid development of electronic device technology,microwave system functions have become complex and miniaturization day by day.Modern micro-packaging technology has already achieved a maximum packaging density theoretically in traditional packaging ways,while 3D integration technology can make a higher one.However,3D integration technology has faced a lot of challenges such as assembly accuracy and RF signal vertical transmission continuity.In this paper,the designs inside and inter-multilayer boards as long as the 3D circuit layout has been presented to foster better technology reserve ability for smaller TR module production with multilayer technology in different application fields.A detailed overview of the research background and the application status of the system packaging technology both at home and abroad has been given and analyzed.The specific concepts of SIP(system-in-package)have been explained,in which the vertical transmission continuity problem in signal transmission process is mainly discussed.The interconnection model has been well established to solve the board signal interconnection in multi-layer structure.Frequency response characteristics of interconnection model have been analyzed,when dimension such as via changes.The vertical interconnection model inside the multi-board with high frequency characteristics has also been presented.As to the inter-board signal interconnection in multi-structure issue,the BGA and LGA technology are introduced to establish the inter-boards interconnection model.Meantime,as to solve the problem of a narrow microwave characteristics of the via in band,the strip line is used to make the parasitic effect of vertical via in band in the microwave frequency field being combined with low pass matching network to realize effective compensate,in order to improve the frequency band characteristics within multi-layer board vertical interconnection.Based on the research achievement,both the circuit design and the experimental data analysis are conducted.The research focuses on the 3D integrated components,in the specific circuit of each component are packaged and folded,using the vertical and bottom circuit board structure can be composed of three-dimensional components.The X-band double-channel receiver module with high packaging density and accuracy has been designed by the 3D integration technology,which boasts a good electrical performance index.At the end of this thesis,the paper summarizes the work of this thesis and looks forward to the application and development of system packaging technology in the field of technology.The problems we studied solved some problems often encountered in the domestic microwave system package.Through the verification of the combination of different components,T/R components with different performance and smaller volume can be developed.The performance of these components in the industry has also been the practical application,indicating that the three-dimensional integrated microwave module in this study is of great significance.