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Research On Key Technologies Of Millimeter-wave Multi-beam T/R Module

Posted on:2021-01-06Degree:MasterType:Thesis
Country:ChinaCandidate:J H XiaoFull Text:PDF
GTID:2428330626955973Subject:Electromagnetic field and microwave technology
Abstract/Summary:PDF Full Text Request
Multi-beam radar has the advantages of superior detection performance,data rate and anti-jamming performance.It plays an important role in modern communication technology,electronic warfare,information warfare,radio navigation and other fields.With the development of integrated electronics,high integration and miniaturization become important development directions in the field of military electronics.As an important part of phased array radar system,there are a large number of T/R modules in radar system.So it is important to realize the miniaturization of T/R module for the whole radar system.Applications of multi-beam phased array radar and the design principle of T/R module are introduced in this paper.Based on advanced packaging technology at home and abroad and highly integrated SiP 3D packaging,an LTCC multi-beam receiving module is proposed in this paper.8 independent and controllable receiving beams are formed.The size of receiving module is 19 mm ? 43 mm.Multifunction chips,eight-way power divider chips,two-way power divider chips and control chips are used in this module.The module consists of a 22 layers LTCC substrate A,and a 43 layers LTCC substrate B,which are interconnected through fuzz buttons.All the electromagnetic transmission structures of 64 sub-channels in this module are designed to ensure the electromagnetic performance.Transition of substrate A signal input,transition of multifunction chip feed and transition of substrate A signal output are designed for LTCC substrate A.For the input transition from 64 sub-channels to 8-channel power divider chip in LTCC substrate B,each sub-channel is divided into 4 parts to design and simulate.At the same time,the design of common three-dimensional vertical interconnection structures and board level interconnection structures are also analyzed in this paper.In addition,a two-way power divider and an eight-way power divider are designed to replace the power divider chip in the module.The performance of the two miniaturized power dividers meet the requirements of the module.Passive test results of the prototype meet the system requirements.At the working frequency,S11 of substrate B is less than-10 dB,and in low frequency part,it is less than-15 dB.The single channel loss is about 5dB.And the isolation is about 30 dB.For substrate A,the single channel S11 is less than-15 dB,and the loss of single channel is about 2dB.
Keywords/Search Tags:multi-beam transceiver front-end, low temperature co-fired ceramic(LTCC), millimeter-wave, system in package(SiP)
PDF Full Text Request
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