Study Of The Design Method Of Microstrip Filters And Balun Module Based On LTCC Technology

MCM (Multi-Chip Module) is an electronic packaging technology developed from 1980s in order to adapt the requirement of the miniaturization, high performance and high reliability of electronic equipments, in which the sticking point is the high density of the multi-chips. LTCC (Low temperature co-fired ceramic) technology is very suitable to be used in MCM manufacture due to its high performance in microwave such as low medium loss, high Q, etc.In this thesis, the vertical interconnect of two LTCC passive models is summarized firstly. And then the design and interconnection of LTCC multi-layer microstrip filter and balun are introduced. A small size LTCC bandpass filter with center frequence of 2.45GHz is simulated with the application of fast multipole method (FMM), equivalent circuits and broadside coupling; Using the theory of coupler and meander line, a passived LTCC balun is simulated through HFSS9.0; It is discussed how...