Research On SiP Key Technology Of Multi Channel Transceiver Module

Since the first radar in the world was manufactured,the technology has been updated rapidly and applied widely.Radar is closely related to production,life,military application,aerospace and waterway transportation.Phased array radar,as a leader in radar,is widely used in military and civil fields.Multi channel transceiver is the core of phased array radar,which is the basic unit of microwave signal transceiver,so its performance directly affects the function of the whole phased array radar.System level package(SIP)is to integrate chips with various functions into a package to achieve a complete function,which makes the components have the advantages of miniaturization and high integration.Therefore,using SIP technology to design multi-channel transceiver module can reduce the volume of phased array and improve the integration.The main research of this paper is as follows:1.In this paper,a new tile type multi-channel transceiver module 3D packaging scheme based on SIP technology is proposed.In the scheme,metal microchannel technology,vertical interconnection technology and HTCC technology are used to make the module have the advantages of small volume,reconfiguration,high integration and low cost.2.According to the above three-dimensional packaging scheme,the vertical interconnection of hairy buttons between boards,the stripline to microstrip line and microstrip line chamfering in the planar interconnection structure,and the coaxial model of HTCC RF board are analyzed,and the required passive interconnection structure is simulated to reduce the loss of components.3.The metal microchannel is designed by microchannel technology to solve the heat dissipation problem of the components.The microchannel is straight,simple to process and easy to integrate.Flotherm software is used to simulate the model.When the initial temperature is 25 ?,the temperature at the receiving module chip is lower than 34 ?,and the temperature at the transmitting module chip is lower than 64 ?.The chip can work safely.4.Finally,a tile type transmitting module and a tile type receiving module are designed to complete the processing,assembly and testing.The receiver module works in 14-14.83 GHz,and its gain is more than 27.4d B,noise figure is less than 4.15 d B,phase consistency is less than 15 ° and gain consistency is less than 1.5d B.The operating frequency range of the transmitter is 10.95-12.75 GHz,the gain is more than 30 d B,the saturated output power is more than 26.34 d Bm,the phase consistency is less than 12 ° and the gain consistency is less than 1dB.